USB4070-30-C

USB4070-30-C
+
  • USB4070-30-C

Product overview

USB Type C Rec. 30u", vertical, SMT with stakes & pegs, T&R with cap

USB Connector Style:

Type C

USB Version:

3.2 Gen2

Center Hight:

+10.40MM

Waterproof:

N/A

Gender:

Receptacle (socket)

Number of Contacts:

24

PCB Orientation:

Vertical

PCB Mount Position:

Top Mount

Contact Pin Type:

Surface Mount

Shell Stake Type:

Through Hole

Locating Peg:

With

Mating Cycles:

20000

flanging:

N/A

Power Rating:

240W

Voltage Rating:

48V DC

Current Rating:

5A

3D Model Generator Electrical Models / PCB Footprints Product Drawing Product Spec PCNs

Material

  • Housing Material: High temperature thermoplastic
    Contact Terminal: High Grade Copper Alloy
    Metallic Shell: Stainless Steel
    Cover Shell: Iron
    Inner Ground Cover Shell: Stainless Steel
    Mid Plate: Stainless Steel
     

Plating

  • Contact Terminal
    Underplating: 50µ" Min. Nickel
    Contact Plating: 30µ" Gold
    Solder Area: 80µ" Matte Tin
    Shell
    Metallic Shell: 50µ" Min. Nickel
    Cover Shell
    Metallic Shell: 80µ" Min. Nickel
    Inner Ground Cover Shell
    Metallic Shell: 50µ" Min. Nickel
     

Electrical

  • Voltage Rating: 48V DC
    Current Rating: Vbus pins collectively 5.00A, GND pins collectively 6.25A, B5 pin 1.25A, Other pins 0.25A per pin.
    Contact Resistance: 40mΩ Max.
    Insulation resistance: 100 MΩ MIN.
    Dielectric withstanding voltage: 100V AC/Minute
     

Mechanical

  • Durability: 20,000 cycles
    Mating Force: 5 to 20N
    Unmating Force: 6 to 20N (post test)
     

Environmental and Processing

  • Operating Temperature: -40°C to +85°C
    Solder Temperature: Peak temp 255°C (+5/-0°C) Maximum (5 seconds)

Material

  • Housing Material: High temperature thermoplastic
    Contact Terminal: High Grade Copper Alloy
    Metallic Shell: Stainless Steel
    Cover Shell: Iron
    Inner Ground Cover Shell: Stainless Steel
    Mid Plate: Stainless Steel
     

Plating

  • Contact Terminal
    Underplating: 50µ" Min. Nickel
    Contact Plating: 30µ" Gold
    Solder Area: 80µ" Matte Tin
    Shell
    Metallic Shell: 50µ" Min. Nickel
    Cover Shell
    Metallic Shell: 80µ" Min. Nickel
    Inner Ground Cover Shell
    Metallic Shell: 50µ" Min. Nickel
     

Electrical

  • Voltage Rating: 48V DC
    Current Rating: Vbus pins collectively 5.00A, GND pins collectively 6.25A, B5 pin 1.25A, Other pins 0.25A per pin.
    Contact Resistance: 40mΩ Max.
    Insulation resistance: 100 MΩ MIN.
    Dielectric withstanding voltage: 100V AC/Minute
     

Mechanical

  • Durability: 20,000 cycles
    Mating Force: 5 to 20N
    Unmating Force: 6 to 20N (post test)
     

Environmental and Processing

  • Operating Temperature: -40°C to +85°C
    Solder Temperature: Peak temp 255°C (+5/-0°C) Maximum (5 seconds)

Material

  • Housing Material: High temperature thermoplastic
    Contact Terminal: High Grade Copper Alloy
    Metallic Shell: Stainless Steel
    Cover Shell: Iron
    Inner Ground Cover Shell: Stainless Steel
    Mid Plate: Stainless Steel
     

Plating

  • Contact Terminal
    Underplating: 50µ" Min. Nickel
    Contact Plating: 30µ" Gold
    Solder Area: 80µ" Matte Tin
    Shell
    Metallic Shell: 50µ" Min. Nickel
    Cover Shell
    Metallic Shell: 80µ" Min. Nickel
    Inner Ground Cover Shell
    Metallic Shell: 50µ" Min. Nickel
     

Electrical

  • Voltage Rating: 48V DC
    Current Rating: Vbus pins collectively 5.00A, GND pins collectively 6.25A, B5 pin 1.25A, Other pins 0.25A per pin.
    Contact Resistance: 40mΩ Max.
    Insulation resistance: 100 MΩ MIN.
    Dielectric withstanding voltage: 100V AC/Minute
     

Mechanical

  • Durability: 20,000 cycles
    Mating Force: 5 to 20N
    Unmating Force: 6 to 20N (post test)
     

Environmental and Processing

  • Operating Temperature: -40°C to +85°C
    Solder Temperature: Peak temp 255°C (+5/-0°C) Maximum (5 seconds)

Material

  • Housing Material: High temperature thermoplastic
    Contact Terminal: High Grade Copper Alloy
    Metallic Shell: Stainless Steel
    Cover Shell: Iron
    Inner Ground Cover Shell: Stainless Steel
    Mid Plate: Stainless Steel
     

Plating

  • Contact Terminal
    Underplating: 50µ" Min. Nickel
    Contact Plating: 30µ" Gold
    Solder Area: 80µ" Matte Tin
    Shell
    Metallic Shell: 50µ" Min. Nickel
    Cover Shell
    Metallic Shell: 80µ" Min. Nickel
    Inner Ground Cover Shell
    Metallic Shell: 50µ" Min. Nickel
     

Electrical

  • Voltage Rating: 48V DC
    Current Rating: Vbus pins collectively 5.00A, GND pins collectively 6.25A, B5 pin 1.25A, Other pins 0.25A per pin.
    Contact Resistance: 40mΩ Max.
    Insulation resistance: 100 MΩ MIN.
    Dielectric withstanding voltage: 100V AC/Minute
     

Mechanical

  • Durability: 20,000 cycles
    Mating Force: 5 to 20N
    Unmating Force: 6 to 20N (post test)
     

Environmental and Processing

  • Operating Temperature: -40°C to +85°C
    Solder Temperature: Peak temp 255°C (+5/-0°C) Maximum (5 seconds)

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