Conn USB 3.0 AF 90度 DIP
Product overview
USB Connector Style：
Type A
USB Version：
3.0
Center Hight：
+4.00MM
Gender：
Receptacle (socket)
Number of Contacts：
9
PCB Orientation：
Horizontal
PCB Mount Position：
Top Mount
Contact Pin Type：
Through Hole
Shell Stake Type：
Through Hole
Locating Peg：
Without
Mating Cycles：
20000
Mating Face Lead In：
With
Current Rating：
1.8A
Materia l
- Contact Material: Copper Alloy
Standard Insulator Material: PA9T, UL-94V-0, Blue
Contact Terminal: Copper Alloy
Metallic Shell: SUS304
Plating
- Contact Terminal
Underplating: 50µ" Min. nickel all over
Contact Plating: Gold Flash
Contact Plating Options: 15µ" Gold
Solder Tail: Tin 100µ"
Metallic Shell: 50µ" Min. nickel all over
Electrical
- Voltage Rating: 30V
Current Rating: 3A
Contact Resistance: 30mΩ Max (Power), 50mΩ Max (Signal)
Insulation resistance: 100MΩ Min
Dielectric withstanding voltage: 100V RMS for 1 minute between adjacent terminal, no breakdown
Mechanical
- Durability: 20,000 Cycles
Mating Force: 35N (3.57Kgf) Max
Unmating Force: Initial 10N (1.02Kgf) Min, Final 8N (0.82Kgf) Min.
Environmental and Processing
- Operating Temperature: -55°C to +85°C
Solder Temperature: Peak temp 260°C (+/-5°C) Maximum (5 seconds)
Materia l
- Contact Material: Copper Alloy
Standard Insulator Material: PA9T, UL-94V-0, Blue
Contact Terminal: Copper Alloy
Metallic Shell: SUS304
Plating
- Contact Terminal
Underplating: 50µ" Min. nickel all over
Contact Plating: Gold Flash
Contact Plating Options: 15µ" Gold
Solder Tail: Tin 100µ"
Metallic Shell: 50µ" Min. nickel all over
Electrical
- Voltage Rating: 30V
Current Rating: 3A
Contact Resistance: 30mΩ Max (Power), 50mΩ Max (Signal)
Insulation resistance: 100MΩ Min
Dielectric withstanding voltage: 100V RMS for 1 minute between adjacent terminal, no breakdown
Mechanical
- Durability: 20,000 Cycles
Mating Force: 35N (3.57Kgf) Max
Unmating Force: Initial 10N (1.02Kgf) Min, Final 8N (0.82Kgf) Min.
Environmental and Processing
- Operating Temperature: -55°C to +85°C
Solder Temperature: Peak temp 260°C (+/-5°C) Maximum (5 seconds)
Materia l
- Contact Material: Copper Alloy
Standard Insulator Material: PA9T, UL-94V-0, Blue
Contact Terminal: Copper Alloy
Metallic Shell: SUS304
Plating
- Contact Terminal
Underplating: 50µ" Min. nickel all over
Contact Plating: Gold Flash
Contact Plating Options: 15µ" Gold
Solder Tail: Tin 100µ"
Metallic Shell: 50µ" Min. nickel all over
Electrical
- Voltage Rating: 30V
Current Rating: 3A
Contact Resistance: 30mΩ Max (Power), 50mΩ Max (Signal)
Insulation resistance: 100MΩ Min
Dielectric withstanding voltage: 100V RMS for 1 minute between adjacent terminal, no breakdown
Mechanical
- Durability: 20,000 Cycles
Mating Force: 35N (3.57Kgf) Max
Unmating Force: Initial 10N (1.02Kgf) Min, Final 8N (0.82Kgf) Min.
Environmental and Processing
- Operating Temperature: -55°C to +85°C
Solder Temperature: Peak temp 260°C (+/-5°C) Maximum (5 seconds)
Materia l
- Contact Material: Copper Alloy
Standard Insulator Material: PA9T, UL-94V-0, Blue
Contact Terminal: Copper Alloy
Metallic Shell: SUS304
Plating
- Contact Terminal
Underplating: 50µ" Min. nickel all over
Contact Plating: Gold Flash
Contact Plating Options: 15µ" Gold
Solder Tail: Tin 100µ"
Metallic Shell: 50µ" Min. nickel all over
Electrical
- Voltage Rating: 30V
Current Rating: 3A
Contact Resistance: 30mΩ Max (Power), 50mΩ Max (Signal)
Insulation resistance: 100MΩ Min
Dielectric withstanding voltage: 100V RMS for 1 minute between adjacent terminal, no breakdown
Mechanical
- Durability: 20,000 Cycles
Mating Force: 35N (3.57Kgf) Max
Unmating Force: Initial 10N (1.02Kgf) Min, Final 8N (0.82Kgf) Min.
Environmental and Processing
- Operating Temperature: -55°C to +85°C
Solder Temperature: Peak temp 260°C (+/-5°C) Maximum (5 seconds)
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