USB4160-03-0230-C

USB4160-03-0230-C
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  • USB4160-03-0230-C

Product overview

USB-C Rec 3u" Vert 24P SMT 2.3mm TH stakes H7.46mm T+R+Cap

USB Connector Style:

Type C

USB Version:

3.2 Gen2

Center Hight:

+7.46MM

Waterproof:

N/A

Gender:

Receptacle (socket)

Number of Contacts:

24

PCB Orientation:

Vertical

PCB Mount Position:

Top Mount

Contact Pin Type:

Surface Mount

Shell Stake Type:

Through Hole

Locating Peg:

With

Mating Cycles:

20000

flanging:

N/A

Power Rating:

240W

Voltage Rating:

48V DC

Current Rating:

5A

3D Model Generator Electrical Models / PCB Footprints Product Drawing Product Spec PCNs

Material
Contact Material: Copper Alloy C1815
Standard Insulator Material: PA9T UL 94V-0 Black
Metallic Shell: Stainless steel SUS304


Plating
Contact Terminal
Underplating: 50µ" Min. nickel all over
Contact Plating: 3µ" Gold
Contact Plating Options: NULLL
Solder Area: Gold Flash over 50µ" Min. nickel
Solder Tail: Gold Flash over 50µ" Min. nickel
Metallic Shell: 30µ" Min. nickel all over


Electrical
Voltage Rating: 48V DC
Current Rating: Vbus pins collectively 5.00A, GND pins collectively 6.25A, A5/B5 pin 1.25A, all other pins 0.25A
Contact Resistance: 40mΩ Max (Initial), 50mΩ Max (After Test)
Insulation resistance: 100MΩ Min
Dielectric withstanding voltage: 100V AC for 1 minute between adjacent terminal, no breakdown


Mechanical
Durability: 20,000 Cycles
Mating Force: 5 to 20N
Unmating Force: 6 to 20N after testing


Environmental and Processing
Operating Temperature: -25°C to +85°C
Solder Temperature: Peak temp 255°C (+0/-5°C) Maximum (5 seconds)

Material
Contact Material: Copper Alloy C1815
Standard Insulator Material: PA9T UL 94V-0 Black
Metallic Shell: Stainless steel SUS304


Plating
Contact Terminal
Underplating: 50µ" Min. nickel all over
Contact Plating: 3µ" Gold
Contact Plating Options: NULLL
Solder Area: Gold Flash over 50µ" Min. nickel
Solder Tail: Gold Flash over 50µ" Min. nickel
Metallic Shell: 30µ" Min. nickel all over


Electrical
Voltage Rating: 48V DC
Current Rating: Vbus pins collectively 5.00A, GND pins collectively 6.25A, A5/B5 pin 1.25A, all other pins 0.25A
Contact Resistance: 40mΩ Max (Initial), 50mΩ Max (After Test)
Insulation resistance: 100MΩ Min
Dielectric withstanding voltage: 100V AC for 1 minute between adjacent terminal, no breakdown


Mechanical
Durability: 20,000 Cycles
Mating Force: 5 to 20N
Unmating Force: 6 to 20N after testing


Environmental and Processing
Operating Temperature: -25°C to +85°C
Solder Temperature: Peak temp 255°C (+0/-5°C) Maximum (5 seconds)

Material
Contact Material: Copper Alloy C1815
Standard Insulator Material: PA9T UL 94V-0 Black
Metallic Shell: Stainless steel SUS304


Plating
Contact Terminal
Underplating: 50µ" Min. nickel all over
Contact Plating: 3µ" Gold
Contact Plating Options: NULLL
Solder Area: Gold Flash over 50µ" Min. nickel
Solder Tail: Gold Flash over 50µ" Min. nickel
Metallic Shell: 30µ" Min. nickel all over


Electrical
Voltage Rating: 48V DC
Current Rating: Vbus pins collectively 5.00A, GND pins collectively 6.25A, A5/B5 pin 1.25A, all other pins 0.25A
Contact Resistance: 40mΩ Max (Initial), 50mΩ Max (After Test)
Insulation resistance: 100MΩ Min
Dielectric withstanding voltage: 100V AC for 1 minute between adjacent terminal, no breakdown


Mechanical
Durability: 20,000 Cycles
Mating Force: 5 to 20N
Unmating Force: 6 to 20N after testing


Environmental and Processing
Operating Temperature: -25°C to +85°C
Solder Temperature: Peak temp 255°C (+0/-5°C) Maximum (5 seconds)

Material
Contact Material: Copper Alloy C1815
Standard Insulator Material: PA9T UL 94V-0 Black
Metallic Shell: Stainless steel SUS304


Plating
Contact Terminal
Underplating: 50µ" Min. nickel all over
Contact Plating: 3µ" Gold
Contact Plating Options: NULLL
Solder Area: Gold Flash over 50µ" Min. nickel
Solder Tail: Gold Flash over 50µ" Min. nickel
Metallic Shell: 30µ" Min. nickel all over


Electrical
Voltage Rating: 48V DC
Current Rating: Vbus pins collectively 5.00A, GND pins collectively 6.25A, A5/B5 pin 1.25A, all other pins 0.25A
Contact Resistance: 40mΩ Max (Initial), 50mΩ Max (After Test)
Insulation resistance: 100MΩ Min
Dielectric withstanding voltage: 100V AC for 1 minute between adjacent terminal, no breakdown


Mechanical
Durability: 20,000 Cycles
Mating Force: 5 to 20N
Unmating Force: 6 to 20N after testing


Environmental and Processing
Operating Temperature: -25°C to +85°C
Solder Temperature: Peak temp 255°C (+0/-5°C) Maximum (5 seconds)

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